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| Subject Spec. No. Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION Part No. 151-EXB-28V02DE EXB28V 1. Dimension 9-1 A a (1)Substrate P L a' T Alumina (4)Termination (Inner) Ag or Ag/Pd Ni Plating Side:Resin+Metal (2)Protective coating Resin (5)Termination (Between) (3)Resistive element Ruthenium oxide (6) Termination (Outer) Sn or Sn/ Pb Plating B G B a-a' sectional plan (1) (2) (3) (4) (5) (6) (0.3) (0.2) Dimension(mm) Dimension(mm) L 2.000.10 P 0.500.10 G W 1.000.10 G 0.250.10 W T 0.350.05 A 0.200.10 B 0.200.10 2. Power derating curve % of rated dissipation 100 80 60 40 20 0 -60 -40 -20 0 20 40 60 80 100 120 140 160 125C -55C 70C Category temperature range -55C to +125C Ambient Temperature(C) Fig. 1 3. Ratings Item Rated Dissipation Rated voltage & Rated Continuous Working Voltage (RCWV) Explanation When used at ambient temperature over 70 C, 0.031 W / element the rated dissipation should be reduced as shown in Fig.1 Chip jumper : Rated current 1 A (Resistance is less than 50 m) The rated voltage of each resistor should be calculated from the equation below, and when the rated voltage exceeds the limiting element voltage, the limiting element voltage should the maximum working voltage. E= PxR Limiting element voltage : 50 V E: Rated voltage(V), P: Rated dissipation(W), R: Rated resistance()) Rated Value MATSUSHITA ELECTRONIC COMPONENTS Co.,LTD. Subject Spec. No. Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION Part No. 151-EXB-28V02DE EXB28V Item Maximum overload voltage 9-2 Resistance tolerance Range of rated resistance for manufacture Rated Value Explanation Voltage should be 2.5 x E. When the voltage exceeds the maximum overload voltage, the value shown below should be the maximum overload voltage. Maximum overload voltage: 100V Chip jumper: Max. overload current 2A sign Tolerance for resistance J 5% 0 Chip Jumper Tolerance J Resistance range 1.0 to 1.0 M Series E-24 4. Explanation of part number E X B 2 8 V 1 0 2 J X Packaging Thick Film Resistor Networks Isolated Chip Circuit Resistor Array Number of terminals 28V Rated Resistance Tolerance Part No. 8 7 R 5 0 0 0 Code X Chip Jumper 6 Circuit 1 2 3 4 Packaging Standard Taping (2mm pitch, 10,000pcs/reel) 5. Appearance & Construction Item Specifications Explanation 1. The resistive element should be covered with protective coating that do not fade easily. The surface of coating should avoid unevenness, flaw, pinhole and discoloration. 2. The electrode should be printed uniformly, as shown in the dimensions. The plating should not fade easily, and should avoid unevenness, flaw, pinhole, projection and discoloration. 3. The electrode should be connected electrically, mechanically to resistive element. 4. Substrate should not have chipping, flaw, flash and crack. Details of appearance criteria shall be as described in attached sheet Appearance & Construction MATSUSHITA ELECTRONIC COMPONENTS Co.,LTD. Subject Spec. No. Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION Part No. 151-EXB-28V02DE EXB28V 9-3 As far as there shall be not designation especially, the following test and measurement shall be operated under normal temperature(5 C to 35 C), normal humidity(45 %RH to 85 %RH), normal atmospheric pressure(86 kPa to 106 kPa). 6. Performance Specification Item DC resistance Specification Test methods Resistor Jumper DC resistance value shall be Measuring voltage: refer to JIS-C5201-1 within the specified tolerance At 20 C, 65 %RH Natural resistance change per temperature Resistance TCR degree centigrade. +600 -6 < 10 -100 x10 / C R2 - R 1 TCR= 10 to 1M 200 x10-6 / C R1x(t2 - t1) R1 : Resistance value at reference temperature(t1) R2 : Resistance value at test temperature(t2) t2 - t1 = 100 C, t1 = 25 C Resistors shall be applied 2.5 times the rated Less than voltage for 5 seconds. (2 %+0.1 ) 50 m Maximum over load voltage shall be 100 V. Resistors shall be subjected to 10000 cycles of 2.5 times the rated voltage applied for 1 Less than second with pause of 25 seconds between (5 %+0.1 ) 50 m tests. Maximum over load voltage shall be 100 V No evidence of flashover, AC 100V between substrate and termination mechanical damage, arcing or for 1 minute. insulation breakdown. Insulation resistance between substrate and Min. 1,000 M termination shall be measured at DC 100V. Temperature coefficient Overload Intermittent overload Dielectric Withstanding Insulation Resistance 7. Mechanical characteristic Item Terminal strength Bend strength the face plating of Specification Resistor min. 4.9N No mechanical damage (1 %+0.05 ) Less than 50 m Jumper Test methods Copper plate: t=0.4 mm Pull speed: 10 mm/s Substrate: Glass epoxy(t = 1.6 mm) Span: 90 mm Bending distance: 3 mm (10 seconds) Solderability Resistors shall be dipped in the melted solder Termination should be covered bath at 235 C 5 C for 2 s 0.5 s. Flux shall uniformly with solder. be removed from the surface of termination (min. 95 % coverage) with clean organic solvent. MATSUSHITA ELECTRONIC COMPONENTS Co.,LTD. Subject Spec. No. Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION Part No. 151-EXB-28V02DE EXB28V Item Resistance soldering heat to Specification Resistor (1 %+0.05 ) Jumper Less than 50 m Test methods 9-4 Vibration Solvent resistance Resistors shall be dipped in the melted solder bath at 270 C 5 C for 10s 1s. Resistors shall be subjected to a single vibration having as double amplitude of 1.5 mm for 2 hours in each three mutually Less than perpendicular directions for total 6 hours. (1 %+0.05 ) 50 m The vibration frequency shall be varied uniformly 10 Hz to 55 Hz and return to 10 Hz traversing for 1 minute. Without distinct deformation in Solvent solution: Isopropyl alcohol appearance (1) Dipping 10 hours 1 hour, dry in room condition for 30 min 10 min. Less than (2) Ultrasonic wave washing: 5 min 1 min (0.5 %+0.05 ) (0.3 W/cm,28 kHz) 50 m Dry in room condition for 30 min 10 min. 8. Environmental Test Item Low temperature exposure Low temperature operating Endurance at upper category temperature Temperature cycling Humidity (Steady state) Salt spray Specification Resistor (1 %+005 ) (1 %+0.05 ) Jumper Less than 50 m Less than 50 m Less than 50 m Less than 50 m Less than 50 m Less than 50 m Less than 50 m Test methods Resistors shall be exposed at -55 C 3 C for +48 1000 hours 0 hours Resistors shall be placed at -65 C 5 C for 1.5hours. After applying RCWV for 45 minutes, resistors shall be exposed in room condition for 8 hours 1 hour. Resistors shall be exposed at +125 C3 C for +48 1000 hours 0 hours. -55 C 3 C, 30 minutes Nominal temp., 30minutes 25cycles +125 C 3 C, 30minutes Resistors shall be exposed at 60 C 2 C and 90 % to 95 % relative humidity in a humidity +48 test chamber for 1000 hours 0 hours. Spray 5 wt% 1 wt% salt water for 96 hours 4 hours at 35 C 2 C Resistors shall be exposed at 70 C 2 C for +48 1000 hours 0 hours. During this time, the rated voltage shall be applied intermittently for 1.5 hours ON, 0.5 hour OFF. Resistor shall be exposed at 60 C 2 C and 90 % to 95 % relative humidity for 1000 hours +48 0 hours. During this time, the rated voltage shall be applied intermittently for 1.5 hours ON, 0.5 hour OFF. (1 %+0.05 ) (1 %+0.05 ) (1 %+0.05 ) (1 %+0.05 ) (3 %+0.1 ) Endurance at 70 C Load life in Humidity (3 %+0.1 ) Less than 50 m MATSUSHITA ELECTRONIC COMPONENTS Co.,LTD. Subject Spec. No. Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION Part No. 151-EXB-28V02DE EXB28V 9. Other characteristics Item Specification 9-5 Test methods Resistor shall be mounted on grass epoxy substrate (t = 1.0 mm). A power of 0.031 W / element shall be applied. The temperature rise at the center of resistor is measured. However, applied voltage must not exceed max. overload voltage. Surface temperature rise Less than 30 C 10. Resistance value marking No marking. MATSUSHITA ELECTRONIC COMPONENTS Co.,LTD. Subject Spec. No. Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION Part No. 151-EXB-28V02DE EXB28V 11. Notice for use 9-6 ! Notice for use (1)This specification shows the quality and performance of the product in a unit component. Before adoption, be sure to evaluate and verify the product mounting it in your product. (2)We take no responsibility for troubles caused by the product usage that is not specified in this specification. (3)In traffic transportation equipment (trains, cars, traffic signal equipment, etc.), medical equipment, aerospace equipment, electric heating appliances, combustion and gas equipment, rotating equipment, disaster and crime preventive equipment, etc. in cases where it is forecast that the failure of this product gives serious damage to human life and others, use fail-safe design and ensure safety by studying the following items to ! Ensure safety as the system by setting protective circuits and protective equipment. ! Ensure safety as the system by setting such redundant circuits as do not cause danger by a single failure. (4)When a dogma shall be occurred about safety for this product, be sure to inform us rapidly, operate your technical examination. (5)The products in this specification are tended for use in general standard applications for general electric equipment (AV products, household electric appliances, office equipment, information and communication equipment, etc.); hence, they do not take the use under the following special environments into consideration. Accordingly, the use in the following special environments, and such environmental conditions may affect the performance of the products; prior to use, verify the performance, reliability, etc. thoroughly. 1) Use in liquids such as water, oil, chemical and organic solvent. 2) Use under direct sunlight or in outdoor or dusty atmospheres 3) Use in places full of corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2, and NOX 4) Use in environment with large static electricity or strong electromagnetic waves. 5) Where the product is close to a heating component, or where an inflammable such as a polyvinyl chloride wire is arranged close to the product. 6) Where the resistor is sealed or coated with resin , etc. 7) Where water or a water-soluble detergent is used in flux cleaning after soldering (pay particular attention to water-soluble flux.) (6)If transient load (heavy load on a short time) like pulse is expected to be applied, carry out evaluation and confirmation test with resistors actually mounted on your own board. When the load of more than rated power is applied under the load condition at steady state, it may impair performance and/or reliability of resistor. Never exceed the rated power. When the product shall be used under special condition, be sure to ask us in advance. (7)Halogen type (chlorine type, bromine type, etc.) or other high-activity flux is not recommended as the residue may affect performance or reliability of resistors. (8)When soldering with soldering iron, never touch the body of the chip resistor with a tip of the soldering iron. When using a soldering iron with a tip at high temperature, solder for a time as short as possible. (Three seconds or less up to 350 C) (9)Avoid physical shock to the resistor and nipping of the resistor with hard tool (a pair of pliers or tweezers) as it may damage protective firm or the body of resistor and may affect resistor's performance. (10)Reflow soldering method shall apply to this product in principle. MATSUSHITA ELECTRONIC COMPONENTS Co.,LTD. Subject Spec. No. Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION Part No. 151-EXB-28V02DE EXB28V 12. Storage method 9-7 If the product is stored in the following environments and conditions, the performance and solderability may be badly affected. Avoid the storage in the following environments. (1) Storage in places full of corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2, and NOX (2) Storage in places exposed to direct sunlight (3) Storage in places outside the temperature range of 5 C to 35 C and humidity range of 45 %RH to 85 %RH (4) Storage over a year after our delivery (This item also applies to the case where the storage method specified in item (1) to (3) has been followed.) 13. Low and regulation (1) No ODCs or other ozone-depleting substances that are subject to regulation under the Montreal Protocol are used in our manufacturing processes, including in the manufacture of this product. (2) All materials used in this product are existing chemical substances recognized under "lows on examination of chemical substances and regulations of manufacturing and others." (3) None of the materials used in this product contain the designated incombustible bromic substances, PBBOs and PBBs. (4) Please contact us to obtain a notice as to whether this product has passed inspection under review criteria primarily based on Foreign Exchange and Foreign Trade Control Laws, and appended table in the Export Control Laws. 14. Period of validity for specification If there is not an offer by letter by 3 months before term of validity, term of validity shall be extended every one year. When you confirm revision of this specification while it is in effect, the previous, unrevised version shall lose its validity. 15. Production Place Production Country :Japan Production Plant Production Plant Production Plant :Fukui matsushita Electronic Components Co.,Ltd.. :Tianjin matsushita Electronic Components co.,Ltd. MATSUSHITA ELECTRONIC COMPONENTS Co.,LTD. Subject Spec. No. Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION Part No. 151-EXB-28V02DE EXB28V 1. Application Range This specification covers taping specification of EXB28V Type. 9-8 2. Physical Dimensions 2-1. Stracture and reel dimensions shall be as shown in the figure below. 11.41.0 Carrier Tape(Paper) Top Tape 60min. 13.0 1.0 0 -3 Unit:mm Adhesive Tape 9.01.0 2-2. Carrier Tape Dimensions P0 D0 E P2 P1 Sprocket hole F B T A Chip hole Chip resistor array A (mm) 1.200.05 P1 (mm) 2.000.10 B 2.200.10 P2 2.000.05 W 8.000.20 P0 4.000.10 F 3.500.05 T 0.520.05 W 180 E 1.750.10 D0 1.50 0 +0.10 3. Specification 3-1.Taping When the test shall be operated with the below conditions, peel strength should be 0.049N to 0.49N, should not have flash and tear after peeling. Carrier Tape 10 Peeling Direction Top Tape *Minimum Bending Radius When carrier tape shall be bent by minimum bending radius (15 mm), no defection of chip and no break of carrier tape. However minimum bending radius shall be tested for 1 times. MATSUSHITA ELECTRONIC COMPONENTS Co.,LTD. Subject Spec. No. Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION Part No. 151-EXB-28V02DE EXB28V *Resistance to climate 9-9 When resistors shall be exposed at 60 C 2 C, 90 %RH to 95 %RH for 120 hours, no defection of chip and no break off carrier tape. When the top tape shall be peeled, tape should not have flash and tear. 3-2. Quantity in Taping: 10,000 pcs. / reel 3-3. Tape packaging *Resistor side shall be facing upward. *Chip resistor shall not be sticking to top tape and bottom tape. *Chip resistors shall be easy to take out from carrier tape and chip hole or sprocket hole shall not have flash and break. 4. Outer Packaging Quantity: 20reels(Max.200,000 pcs.) Tape Marking *When packaging quantity does not reach max quantity, the remaining empty space shall be buried with buffer material. *When quantity shall be few, alternative packaging methods may used. No problem must occur during the exportation of the product.. 5. Marking *Side of reel(Marking shall be on one side.) (1)Part name (2)Part number (3)Quantity (4)Lot number (5)Maker name *Packaging box (1)Customer name (2)Part name (3)Part number (4)Customer part number (5)Quantity (6)Maker name MATSUSHITA ELECTRONIC COMPONENTS Co.,LTD. Subject Spec. No. Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION Attached Sheet APPEARANCE QUALITY CRITERIA Item Defect Criteria Appearance Criteria 1-1 Remark B C Resin Chipping A W A W/16 B C/2 Both side chipping shall be judged defect D B C B A Terminal Chipping A C/4 B Top terminal width D 3C/4 Oblique line show chipping Pin Hole This item is applied to One pin hole / pin holes which reach chip resistor to the resistive 0.2 mm materials A Flash A 100 m A MATSUSHITA ELECTRONIC COMPONENTS Co.,LTD. |
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